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HY2.0尘尘间距 立贴带扣 封装规格书下载
文章作者：宏利电子 | 发布时间：2020-11-20 17:25:29
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- 首页
- 0.5尘尘间距
- 0.5Pitch H1.0翻盖
- 0.5Pitch H1.2上接
- 0.5Pitch H1.2下接
- 0.5Pitch H1.2翻盖
- 0.5Pitch H1.5翻盖
- 0.5Pitch H1.5后掀
- 0.5Pitch H2.0后掀
- 0.5Pitch H2.0上接
- 0.5Pitch H2.0下接
- 0.5Pitch H2.0翻盖
- 0.5Pitch 立贴正位
- 0.5Pitch 立贴反位
- 0.5Pitch H1.5双面接
- 0.5Pitch H1.5-2.0-2.5板对板公座
- 0.5Pitch H1.5-2.0-2.5板对板母座
- 0.5Pitch H1.8翻盖
- 0.5Pitch H4.0-5.0板对板公座
- 0.5Pitch H4.0-5.0板对板母座
- 0.5Pitch H1.0后掀
- 0.8尘尘间距
- 1.0尘尘间距
- 1.25尘尘间距
- 1.5尘尘间距
- 2.0尘尘间距
- 2.5尘尘间距
- FPC 3.5mm/2.0mm
- 3.96尘尘间距
- 0.5尘尘间距